In this paper, we present the optimization and investigation of fluid flow and heat transfer in advanced heat sink geometries by the application of Computational Fluid Dynamics. Three new heat sink configurations (C1, C2, and C3) were optimized and compared with the traditional straight-fin heat sink to analyze the thermal and hydraulic performance at varying operating conditions. Simulations were carried out for varying Reynolds numbers (200 to 1000) with constant heat flux (266,000 W/m²) to simulate the conditions for electronic applications with high power. Results indicate that fin thickness and shape play a crucial role in heat transfer efficiency and pressure drop. For instance, the Nusselt number increased by 47% (from 7.48 to 22 for Re=1000) with increased fin thickness from 1 mm to 2 mm, but the friction factor increased by 120% (from 0.17 to 0.374 for Re=1000) accordingly. C3 had the highest maximum thermal performance with the highest Nusselt number (38.4 at Re=1000) which is an enhancement of 123 with respect to the traditional design. The Thermal Performance Factor (TPF) of C3 had a maximum of 1.456 with Re= 600, which was the most appropriate ratio between heat transfer improvement and pressure drop. The temperature contours and velocity profiles showed that there is good dissipation of heat and flow dynamics with temperature differences that come with a 30-55 temperature range and velocity difference indicating the recirculation zones where efficacy of transferring heat occurred. The observations are very useful in designing advanced heat sinks that will have the potential of better thermal management in the electronic systems of high power. The work bridges the gap that has been there between experimental optimization and practical use that is geared towards the advancement of more efficient cooling technologies of contemporary electronics.